Articles, Press Releases, Publications
RISC-V
Micro Magic, Inc. Delivers Ultra-low Power 64-Bit RISC-V Core
-- PRESS RELEASE --
February 12, 2021
Today, Micro Magic, Inc. announced its Ultra Low power 64-bit RISC-V core consuming only 10mW at 1Ghz.
Micro Magic, Inc. Delivers World’s Highest Performance/Power RISC-V Core
-- PRESS RELEASE --
November 29, 2020
Today, Micro Magic, Inc. announced the world’s highest performance/power 64-bit RISC-V core at 110,000 CoreMarks/Watt.
... more ...
Micro Magic, Inc. Unleashes World’s Fastest RISC-V Core
-- PRESS RELEASE --
October 23, 2020
Today Micro Magic, Inc. announced the world’s fastest 64-bit RISC-V core achieving 5GHz and 13,000 CoreMarks at 1.1V. A single Micro Magic core running at 0.8V nominal delivers 11,000 CoreMarks at 4.25GHz consuming only 200mW.
Fast Iteration: A Performance Design Requirement
Richard Smith
Impact of process scaling on the efficacy of leakage reduction schemes
Tsai, Duarte, Vijaykrishnan, Irwin
-- Intel Corporation
Challenges and Methodologies for Implementing High-Performance Network Processors
Bhamidipati, Zaidi, Makineni, Low, Chen, Liu, Dahlgren
-- Intel Corporation,
Intel Technical Journal
DAC 53, Austin, TX June 2016
Dawn breaking over Austin
Main Aisle
- DAC 53 -
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Austin Convention Center
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June 06, 2016
DAC 53 - DAY 1
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An intense technical conversation
DAC Day One
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Many software demos are given
Early Morning
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Beginning the Third Day
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June 08, 2016
Dusk settles over Austin
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Lovely closing to a busy day
DAC Day 3
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Fire Alarm! and Full Evacuation
A Firetruck outside ACC
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Fire response was very quick
DAC Day 3
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MMI President Santoro
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Giving a demo featuring Analog
Official Bagpipers
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Bagpipes traditionally close DAC
“Tezzaron has taped out over 100 3D chips using MMI’s MAX-3D tool suite. There’s nothing to compare, and the new TSV placer & MAX-3D Path Finder are incredible.”
Robert Patti, VP/CTO, Tezzaron Semiconductor
“This is one of the few tools that can deal with multiple levels of hierarchy and multiple tech files all at the same time, and it is awesome for visualization of complex things like, say, PDN mesh across multiple die and interposers. Fantastic! I like it!”
Riko Radojcic, Director of Design for Silicon Initiatives, Qualcomm