MMI 3-D TSV/Wafer-Stack Co-Design tools

MAX-3D TSV Placer

Automatic TSV Placement

MAX-3D TSV Placer is a simple-to-use, powerful tool for automatic TSV location, optimization and placement.

MAX-3D TSV Placer automatically finds "holes" for TSVs, and then automatically optimizes and places the TSVs.

TSV Placer shows 3D connectivity with flylines, and exports the TSV data back into your 2D tools.

The following examples illustrate a few of MAX-3D TSV Placer capabilities:

Video demonstration: (50 s)
In this real-time example, TSV Placer is run on a layout, resulting in all TSVs being positioned on the outside edges. Modifying the position of two chips, then re-running TSV placer, you notice the TSVs are now placed in a row in the center.

3D view of placed TSVs on 3-level wafer stack. At left: flylines show connectivity between three chip levels; at right: the correctly positioned TSVs for each wafer level.

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In the following video clip, blocks are placed on 3 stacked die, with connectivity shown via fly-lines. A simple menu-click automatically places the TSVs for all three die at once.

Video demonstration: (50 s)
3D floorplan: Connectivity for 3 stacked die; automatic TSV placement with demonstration of a blocking region leading to TSV shift, and routed connections.

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The real-time video clip, below, demonstrates automatic placement of TSVs on a design with three chip levels.

The first image, a view of "before-and-after", clearly shows the TSV placement for 2 chip levels.

The second image is the three-dimensional view of the TSV placement. All Micro Magic tools provide this 3D layout view.

Before and After of TSV placement screen shots courtesy Tezzaron

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In a more complex example of placement, this video illustrates the flylines and subsequent auto-placement of TSVs

Video demonstration: (33 s)
Blocks on 3 stacked die with connectivity fly-lines; subsequent menu-click for TSV placement, displayed in 3D.